Hello <@U017UPJEGKZ>, I have been taking a look to...
# power
j
Hello @User, I have been taking a look to your design and running the simulation. We are designing a DCDC, and we are now focusing on the power stage. I noticed that you use the 5.0V/10.5V FETs, and that the current driving capability seems to be the best (checking the IDSNS50H) compared to other power devices in the technology (e.g. 20V). Was this the motivation of your choice? Also, how did you do the sizing of the power NMOS and PMOS? Considering you used 300mA output, the sizes seem to be much higher that what is needed for this current (at least from my quick calculation), is this just overdesign to make sure you are far from the maximum current density, or there are other considerations?
w
Not very precise, but I targeted the size of the FETs based on the efficiency I wanted.
How are you deriving current capability? Transconductance? I dont remember seeing any actual current density limits for the PDK.
the 5.0V/10.5V fets are the FETs with the lowest voltage rating that met my application. I assumed the 20V devices would be worst. I dont think I actually got the models for them working though. I think the 20V devices are just the 10.5V devices with extended drain and some more layout rules?
Do the models actually capture the resistance of the extended drain region? I was under the impression that it did not.
j
hello Weston, thanks for replying what I called current capability is actually the spice model parameter for the current given in the PDK doc (e.g.the IDSNS50H parameter for the 5.0V/10.5V NMOS FET, when W/L = 7/0.50) how did you relate efficiency with the sizing? sorry if the question is too basic. Did you calculate this, or it comes from the RDS_ON drop in simulation for example?
w
Huh, not sure what that current is. Is it some saturation current or something?
I took some V/I curves of a single finger to calculate the Rds_on and then sized the number of fingers I wanted based on my target RDS_ON values, which I roughly sized based on my efficiency target
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j
hello @Weston Braun, why did you characterize a single finger here? did you extract the parasitics of that finger to account for their effect in Rds_on?
w
I believe the models take into account the resistance of the diffusion from the channel to the contacts. I did not extract resistance parasitic beyond what was captured in the base model. Magic was not that good at resistance extraction at the time, I dont know what the current status is.
My measurements show the resistance of the metal interconnect is small compared to the fet on resistance, with the exception of the actual connection to the pad from the edge of the user project area and the bond wires.
it would probably be easier to run the extracted metal layers through some 2D FEM solver like FEMM or something.