given the shuttle is going to be WLCSP, does anyone know how feasible its going to be to probe test pads with a probing station?

@Weston Braun i was wondering myself, i wonder if they could supply packaged and unpackaged dies?

yah, I think thats really the only way to do it? Then you would have to bond them out to some lidless carrier to be able to put it on a probing station with the die exposed

Someone was talking about holes in the overglass (polyimide?) layers for probe points too, for probing signals on the die itself. That would be handy.

that would sorta work, but then you still cant access the underside of the die without alternative mounting.

hmmm good point

i've attempted probing WLCSP solder balls with a probing station, it's very difficult but not impossible

its not making electrical connections to the IC pins, its probing structures which have test pads but would not be balled / bonded out on the IC. Like if I want to measure some test structures, or check some voltages internal to the IC.

You can also make a test bus to allow internal signals to be muxed to the outside world

How do we organise to get the packaged chips mounted onto a daughter board then? Something like this.