@User: Antenna problems come from manufacturing, not from use. The high charge builds up on metal lines that are floating (i.e., not tied to diffusion). There is no "VDD" during manufacturing. There is only charge buildup on whatever metal layer is on top, during deposition. This charge can get quite high, which is how it can blow a hole through a gate. Any connection from the metal layer being deposited down to the wafer substrate bleeds away the charge and (if it bleeds away fast enough) prevents it from building up.