Will GDS for the redistribution and solder bump layers be provided prior to tape-out?

Almost certainly not because I don't think I will have the time to get around to it, and since it's a post-process step, I don't need to get it to SkyWater right away. So naturally it will get bumped down on the priority list. That said, the documentation in the caravel repository shows the bump map and all the pin assignments, and those are final.

Ok, fair enough. It makes putting small M3/M4/M5 inductors under the gaps between the redistribution metal a game of luck, but my progress learning the tools is so slow that it doesn't really matter this time round anyway.

@Chris Jones: You can look at the example layout of bump bonds in the caravel/mag directory called "padframe2.mag". The array of bump bonds and the bump pitch is correct; what is not correct in that layout is the location of the pads in the padframe, but the padframe dimensions are correct. You can figure out where the redistribution routes will be from the bump map in the documentation.