In the ideal case I will be able to shop:
Top metal optical photo. This is the fastest.
Polysilicon optical photo.
Polysilicon SEM photo, some places in high resolution to compare GDS vs layout (OPC e.t.c)
Crosssection of the chip/transistors – this is possible, but will require more time/more samples. Maybe special structures prepared in advance to make it look better with less trials : i.e. 2x 50um long transistors (N+P / maybe other types of transistors) with full stack of metal on top of them). So that I can cut across this reliably and show xsection to see how these specific transistors are made.