You can't produce a process model just from the machine rule deck. These are just rules that, when violated, cause physical issues such as metal delamination, photoresist sloughing off, etc. That is, if you violate these rules, they can cause problems for the foundry because bits of metal or photoresist come off and can spread around on the wafer and mess up other parts of the layout, such as e-test, which could then cause massive problems with the manufacturing. The non-machine rules are rules which, if you violate them, may cause your chip to come back non-functional but otherwise, the foundry doesn't care.