Diarmuid,
Razavi was trying to do something unique with a bare die and it was the custom process and legacy and out of control bond machine wire placement variability that introduced the issue. (He had been comfortably hammering bondwires onto thick glass and passivation all around the pads on other fabs test shuttles and so was very frustrated when we expected him to place the whole bond wires joint on the pads rather than the glass.) 😉