Hi All. In Razavis paper (attached) he comments on the brittle passivation layer in SKY130 and how it gave him problems with parts which were wedge bonded (force of the wedge bonding cracked the passivation layer). This was avoided by changing to ball bonding. Do we know are the packaged parts from Efabless ball bonded? Specifically from the chip ignite programe but I presume the same bonding technique is used for all packaged parts from Efabless.