@aquiles viza Points to Observe
• The COMP fill is too close to active COMP areas.
• Maintain a distance of 3.2 units between dummy_poly2 and COMP.
• The METAL fill is too close to active metal areas.
• Ensure there are no dummy metal pattern fills in the following areas: MIM CAP, Poly fuse, Metal fuse, so avoid areas above MIM caps.
For Poly fill:
Space between two(or more) not connected _dummy_poly2_ = 2.4
Space of _dummy_poly2_ to COMP = 3.2
Space of _dummy_poly2_ to *poly2*(ACTIVE) = 5
Space of _dummy_poly2_ to Nwell boundary = 1
Space of _dummy_poly2_ to DNWELL boundary = 2
Space of _dummy_poly2_ to LVPWELL boundary = 1
Space of _dummy_poly2_ to Dualgate boundary = 1
Space from _dummy_poly2_ to Resistor marking layer (RES_MK) = 19.7
Space of _dummy_poly2_ to Pad = 6.7
Space of _dummy_poly2_ fill to active circuit metal1 = 2
Space of _dummy_poly2_ fill to active circuit metal2 = 2
My idea is to create a function to avoid all this above mentioned layers, and make the distance +10um (except for RES-MK).
I did not read all the rules yet, but we need more people on this if we are going to create the scripts from scratch, there is a lot of rules. CC @Atif Khan @Juan Sebastian Moya
The relationship between Dummy_poly2 and Dummy_COMP needs to be clarified, as they should interact in a specific manner. I am currently investigating this further to understand the details.