Hello All, Following one of our question (Cubesat DCDC team) from last friday's session, we have some concerns about the packaging electrical and thermal characteristics. • Regarding bonding wires (we assume QFN uses them), we would like to know what's the maximum current density and the parasitic elements associated. In particular, since we are studying the chance of placing some passive components offchip, we would like to know what's the parasitic inductance. We are using 1nH per bonding pad for now, is this right? • Regarding the QFN package itself, what other parasitic elements/values can we expect? Is this specific for the packaging provider or is it generic? • Regarding the thermal resistance of the package, can you provide this information? We found this table: https://www.analog.com/media/en/package-pcb-resources/package/thermal-table.pdf, do you think we can trust this for our case? How many pins does the QFN include, by the way? Thanks in advance! @Boris Murmann @Tim Edwards