@User, @User: I have mentioned in the past that there are no characterized inductors in this process. However, it is now looking like we will be able to get SkyWater to add the redistribution layer metal (RDL) to the process, as part of the WSCLP (bump bonding) packaging. There are several inductors in the RDL layer that are completely characterized. I will be adding the RDL support and making sure those are available.