@User: Note that the "best" inductors are done with the thickest metal, which is why the redistribution layer is preferred. However, as we are using the redistribution layer for bump bonds, that means that there will be a limited amount of space for making inductors. However, as there can be a maximum of three ranks of bumps on any one side, and we intend to fill the full (approximately) 4.5 x 4.9 mm area, we should be able to accommodate more than the originally specified 48 pins, and there will be more than one bump's worth of space in the middle. Once I have floorplanned the first layout for the harness, I should be able to advise how many inductors we can put in the middle of the chip, and what the maximum size can be.