@User: Removing the caravel processor means that you will have to attend to every detail of the padframe. For example, the padframe power busses are divided into domains; by removing the right side of the padframe, you will disconnect the user area power supplies and leave some of the power supply lines on the top of the chip floating unless you rewire the power domains. If you remove the power-on-reset circuit, then you need to make sure that the enable lines for all the pads are driven, and that they power up in the correct sequence. You will need to make sure that all the GPIO pins are being driven to the correct values. Of course, if you just power down everything so you can connect the inductors to an S-parameter test instrument, then it probably doesn't matter what you do with the rest of the padframe. You appear to have kept the positions of the existing pads---if you intend to use this with the bump-bonded chip, then bear in mind that you will have huge bump bonds sitting directly on top of your inductors. If you intend to get back a bare die from a wafer that is not bump-bonded, and get it wire bonded yourself, then why not just put pads whereever you want them in the middle of the user project area?