The whole NIST initiative is designed to support MEMS, but it's something that has to be post-processed on top of the finished wafer/die; it won't be done by the foundry. But it can be considered "MEMS enablement".

Amazing! Would you mind reference some docs about the details of the process?

There's not much to say because it hasn't been defined yet, but the general idea is to create a version of Caravel in sky130 that does not use the topmost metal layer (metal 5), and have SkyWater stop processing the wafer after metal 4 + polishing, then deliver bare dies (or, potentially, wafers) to customers to run MEMS post-processing on top of that.

Thank you so much Tim 🙏🏻