Hello! together with @Nico Calarco we were wondering if the no-bare-die restriction of the PICO program was updated in the FAQ of the contest, we thought it was possible to get some bare dies

Update: I just heard that Efabless can provide bare die for our November run.

hello @Boris Murmann @Tim Edwards, we just wanted to confirm the bare die availabilty for the November Chipignite run in which the Chipathon designs will be fabricated. Also, are there any news about the SKY130B tag in the MPW run, which was supposed to be SKY130A?

Yes, you will get bare die, see chipIgnite info on Efabless website. The run will be sky130b.

OK, thanks @Boris Murmann Anything to consider for analog designs due to the change to sky130b?

@Tim Edwards may know. It's just a different metal stack as far as I know.

@Jorge Marin: Just be aware that the via from metal1 to metal2 is 4.5 ohms/square in the nominal corner, but with the ReRAM process this doubles to 9 ohms/square. But there is a lot of process variation, so at the high resistance process corner you can be looking at a maximum of 30 ohms/via. Just keep that firmly in mind for analog designs. But then at the high resistance corner, poly and diffusion contacts can be hundreds of ohms per square (worst case: p-diffusion contact, at a maximum corner value of 840 ohms/square), which doesn't even have anything to do with the ReRAM process; that's just a consequence of the titanium nitride. So be sure to use lots and lots of contacts.

@Tim Edwards thanks for the info. It's a pitty that we get to know this so late, we thought it was an error in the MPW description. Do we need to modify anything in the pdk settings? We are using the analog docker.