Hi All , two queries : 1 ) are the below timelines for chip ignite program are same for university programs too ? 2206Q June 17, 2022 >>- October 12, 2022 2) ReRAM silicon can be provided in this timeline too , if tapeout is done on the 2206Q shuttle. 3) For previous MPWs , that had ReRAM inside , have the university / free shuttles received back the silicon ? Thanks

MPW-four is the first batch to support ReRAM, and it is currently being bump bonded.