So ... how's MPW-ONE doing ? Any news that I missed ?

If anyone knows what the current status is (other than SkyWater), it would be @jeffdi.

We are expecting wafers out from the foundry on 8/26.

@jeffdi Tx for the update. What are the next steps and expected time frames ? (Not pushing, I've just got no clue how this works and I'm curious 😅) I guess if those are the bare wafers, they need to be sliced. Possibly have the RDL and balls applied too.

The MPW-one batch will be split into two parts, one of which goes directly to the customer for wirebonding, and one of which goes to Micross for bump bonding. The bump bonding adds something like three weeks to the process (although I can't imagine what causes it to take that long). Micross is in the U.S., so there are no additional delays due to international shipping and customs, fortunately.

Has the carrier/test board been made yet or will those be done after the bonded chips reach efabless? Also - will we get high-res die shots of the fabricated parts? (I vaguely recall this being mentioned but not sure if the foundry provides it or not)

I'm also interested in knowing about the carrier board status. If the IO are broken out to a pair of headers or something then I'd like to make a simple breakout board for it to plug into, and a Kicad footprint/symbol would be very helpful for that if one gets made

@Anish, @drr: We will be working on the carrier board this week as the MPW-one wafers get back from fab. Most wafers will get the WLCSP which means they get shipped off to Micross for post-processing. The boards then should be ready for everything to be assembled when the wafers get back from post-processing.

👍 appreciate the update