Does anyone know what material is LI made from? Is...
# sky130
m
Does anyone know what material is LI made from? Is it a silicide poly? The resistance is closer to poly (1/4 of it) than m1 (100x more)...
r
Hey! I've found this presentation online and it says that LI is made out of TiN http://ef.content.s3.amazonaws.com/FOSS_Stine_SoC_Final.pdf
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m
@James Stine do you have any more reference or info on the TiN layer? I'm more interested in just understanding the manufacturing details
r
Unfortunately, not. but I would like to know more about too.
m
James made that presentation, so I tagged him. He may know more...
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j
sure…will try to communicate more on it - still stuck away so will try to give more information. Will get back to you shortly.
r
I didn't paid attention that you tagged him. Sorry
j
np @Rodrigo Wuerdig
li or local interconnection is TiN - rest are Al. The li1 is 97.6x more resistance per square ohm than m1. My Ph.D. student @Teo Ene figured much of this out. We tried to avoid it due to this feature and got better performance on our cells. We avoided it by putting an obstruction in the LEF layer. That is, we provided all cell in/out pins on metal1 and prevent routing on li1.
better said - not an obstruction but just labeled li as a non-routing layer.
m
Yeah, I understand that (it was in my question). The question is about the processing of it.
j
From what I understood, its left over from the previous process. Not sure about the processing other than TiN is an alloy
let me know if you were looking for something else - I probably missed something (sorry)
m
Yeah, I was more wondering if it is a TiN layer on top of poly or ... something else
j
I think it even pre-dates the SKW acquisition
m
This is a purely processing question
j
gotcha
As far as I know its an actual layer above poly - hold on I think have something on it somewhere
m
It could be a second poly with a different silicide (the TiN?)
r
On slide 33 of that presentation there's a diagram. It's above poly
m
It's definitely above poly, yes
j
I know I have something on it - will find
its a great question 🙂
m
I believe it is the same layer that IBM used to have "submetal" or "metal zero"?
r
Sorry to interrupt the ongoing question. But what is the purpose of this layer actually (I am more familiar with other pdks)? Is it meant to avoid going M2 while doing intracell routing?
m
It's meant to be used in the local interconnect inside SRAM bitcells
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so that M1 and M2 can be used for wordlines and bitlines
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j
okay found it
so the TiN process is been around for a while - its typically used for high-precision metal element since its abundant. And, in the past its typically used for good analog designs which really defeats our purpose for digital. So, that’s one of the reasons I avoided
Ti is a great getter of oxygen so you can use it with TiO2 and TiN as a barrier
I believe some of my literature has this item being used for last 40 years
hope that’s what you were looking for - sorry it took a while
m
yeah, that's more useful
thanks
j
np; always happy to help 😉
l
@Leonardo Gomes Read this thread. This explains the locali Ti layer.
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