@User: Where are you getting your current density limit numbers from? I have not found any electromigration rules for this process. You're using some reference with standard values/constants/equations for aluminum interconnect?

general numbers for aluminum interconnect

Based on values from a very similar process, I would estimate 1.5mA/um for metal3. There are two stubs at 24um wide, so the power pad as is should be good for nearly 75mA continuous. There is no metal3 to the sides, so I can stretch that out, not indefinitely, but maybe to 3x, then connect them into a single stack of m3 + m4 + m5 at the edge of the user area. Then you just need to connect the same stack of m3 + m4 + m5 at the position of the pins where there is only a m3 pin currently. Then you should be able to get 225mA through the pad.

that sounds like it should work!

Yes, that's right. I'll need to hand-edit the padframe layout; I think there is some routing in it that OpenLane does, so I will wait until that is finished before I make manual changes to it. But yes, that's the plan, to take the existing metal 3 and triple it up to include metal 4 and metal 5.