Yeah, they have been developing (re-inventing) all the semiconductor fabrication processes, so the technology is under improvement. They firstly employs maskless DMD exposure that has resolution down to 0.5um, and also developing EB exposure system for further shrink. However, there are many other factors that prevent to fabricate CMOS 0.5um, although they have been trying to solve problems. Currently, in order to indicate the feasibility of fabricating MOSFEt, they are using roughly 5um with much safety margin.