Hi does anyone with bare die from a chipignite or openmpw runs have any reliable method for wirebonding (gold ball or silver wedge)? we have a few bare die remaining, but have not been able to really find a reliable wirebonding solution with the equipment we have here and would like to bond and test the last few. We run into our wedge bonder causing shorts between pads, while our semi-automatic ball bonder has just been unreliable, causing a variety of issues. If anyone has tips, or a packaging house that they have used for the exact same die, it would be great to know