Hi everyone, I am working on an RFID project using SkyWater's 130nm technology and I am wondering if it is possible to remove the caravel, as this could affect the performance of the project significantly. If the caravel can be removed, have I a larger space available for the chip design? That is, I would have 3.2 x 5.3 mm instead of 2.92 x 3.52 mm ? Thank you in advance.

Not possible at the moment

@Tim Edwards @Matt Venn is there an option if we also do a custom padframe fits to the current die area?

No, it's not possible. It's being considered for future runs, but it will be announced in #announcements and on the public mailing lists if and when it happens.

One thing you can do, though, which has been done before, is to create your entire design inside a custom padframe that fits inside the user area. There is no requirement to connect to the user project wrapper pins. That limits your total area considerably, but gives you complete freedom to do whatever you want with the area. Note, however, that you would need to do this on a ChipIgnite run, because all Open MPW runs are post-processed with bump bonding on top, which would interfere with any custom pads.

Oh wow, I didn't know that #announcements existed...!