#402 New "User Power" IO cell Issue created by smunaut Currently if you want to provide a custom power rail to some logic inside the chip, the analog pad is the only option. However as explained in #401 , the connection from the bond pad to the internal user logic in that cell is not very strong and not suitable for a power rail connection. Ideally I'd want such a pad to be rated to 50 ~ 100 mA and present less than 0.5 ohm between the bond pad and the internal connection. IHP-GmbH/IHP-Open-PDK