open-source-silicon.dev

Do we have access to a GDSII or other vector art for the padframe for the WCSP packaging? I'm trying to do floorplanning for a mixed signal design and I'm worried about placing things too close to solder balls. I'm happy to do some basic package modeling myself but need dimensions and ideally bulk properties of the metal to get started.

The GDS of the redistribution layers and solder bumps is in the caravel repository but you'll need to get the early MPW-one version to find it;  the MPW-one version was copied to its own repository <https://github.com/efabless/caravel_mpw-one> and the layout is `gds/caravel_bump_bond.gdz.gz`.

Bulk properties of the metal are hard to come by because everything Micross does is custom.  You can check with <@U016HSAA3RQ> about what the layer specifications are that we put on the form for submission to Micross.  The redistribution metal layer is copper and I think is the default 3um thickness.  This is sitting above a 5um polyimide layer.  That's probably good for a rough approximation of the effect of the bump bonds.  If you need any additional information, just let me know.