Hey all, we are considering the chipIgnite CI 2409 tapeout in which we are planning to do measurements directly with RF probes, meaning we need RF landing pads. We were wondering what the bare die option entails in terms of WLCSP. If we make probe pads up to M5 and draw a pad opening, will that be enough or do we also need to draw the RDL layer?

We have not been doing WLCSP since the open MPWs. You should just draw metal 5 and pad glass cut, and request bare dies to be sent back to you.

Great, thank you!