Hi, I am working on a layout design using Magic. I have one question regarding signal vias in IC layout. In my layout, I have stacked 4 vias (MCON - VIA3) at the drain and source of my transistors. Will there be an issue in the IC in terms of reliability?

There is no limit on via stacking in Sky130. There is, however, a recommendation for vias with multiple cuts where there is room to put them. Of course, every additional via cut will reduce the resistance of the connection and also increase the reliability (although a connection failure due to a bad via is a very, very low-probability event).

@Tim Edwards Thank you so much for your reply. One more question, does the distance between each cut matters in power rails (except DRC cleaning) in terms of current carrying capability?