Is the caravel packaging wire bond or flip chip?

caravel is the harness we use to tapeout, it's the padring and has so far always contained the riscv processor

We have not done flip-chip recently due to the expense (both time and money). Although the wirebonding got rather back-logged with MPW-5 through MPW-8, we will probably stick with packaging in wirebonded QFN packages unless we can find another vendor or negotiate a better deal on price and turnaround time for the WLCSP.

Okay cool! I was trying to look under the hood and see how you go from user project wrapper to package. It looks like you use a cell similar to the foundry provided gpio2? Does that expose a pad on the top of the die that then gets wire bond?

I don't really get that question. The user project wrapper gets placed inside the caravel harness chip; the caravel harness chip has a padframe with 63 bond pads, including gpiov2 plus power and ground pads and others. This is all spelled out in the caravel documentation.