I want to learn more about what is required for a chip outside just putting a design on the user project area. Are there any good guides on things like esd protection, padrings, power, packaging, etc?

Each of these topics that you have listed are specialities on their own that companies usually have dedicated teams for each: - Chip packaging - I/O Pads (including esd) - Power delivery (PDN) In addition to this, the RF, Analog & mixed signal blocks (like PLLs, temp sensors etc.) would also be handled by a separate team Also, Chip packaging and PDN come under the SI-PI (Signal Integrity, Power Integrity) domains and are somewhat identical to PCB design in terms of the basic principles. It would be better if you search for separate books for each of these. But I am not sure if there are graduate textbooks that deal with these on a step-by-step detailed application basis I guess, someone who has worked on this hands-on would be able to provide a more detailed answer.