Hello, Our team has placed an order for ChipIgnite 2306Q bare dies for a packaging application. I'm working on attaching this die to a flexible substrate or another MEMS die. For the purpose of packaging, I would like to understand the bond pad count, pad sizes, pitch, pad finish, pad architecture/thickness, any passivation layers, and pad layout. Any information on this is highly appreciated.

The pad count on caravel is 63. Pad sizes (glass cut opening) is 70um x 60um. Pitch varies, but the minimum pitch is on the left hand side and is 216um. Pad finish is aluminum. Pad architecture is metal 5, 1.26 microns thick. Passivation is SiO2 0.09um covered by SiN 0.54um. There is no polyimide layer. See the stackup drawing at https://skywater-pdk.readthedocs.io/en/main/rules/assumptions.html#process-stack-diagram (but note that the polyimide in the drawing is an error and does not exist in this process).

Great..! Thank you.

It depends on how you do the measurement. x4 and x5 are the outer dimensions of the padframe but do not include the seal ring. The seal ring is 6um wide and so adds 12um in each dimension, making the outer dimensions including the seal ring 3.6mm x 5.2mm exactly. For the dimensions x1, x2, x3 do you want the measurement from glass cut edge to glass cut edge? The layout is of course available in open source, and is at https://github.com/efabless/caravel/blob/main/gds/chip_io.gds.gz.

Great. Thank you for sharing the link to the layout. It answered my questions.