Hi everyone! I'm trying to make gsg pads for an analog block we plan on putting in the upcoming gf180 shuttle. I just wanted to make sure that the layer for cutting passivation that I need to use is glass. Would metal 5 and glass alone be enough, or do I need any other layers too? Thank you for your help!

Your best option is just to use the existing cell

Bondpad_5LM

from the GF I/O repository. If the standard pad opening of 60um x 60um is too big for you, then you can at least look at what GF did, which is metal 5 and glass but also a stack of metal and vias from metal2 up underneath. The metal2-to-metal4 stack is done in vertical stripes of width 1.7um with 0.3um space in between the stripes.

Thanks!