Hi <@U016HSAA3RQ>, <@U03DTLZU9U7> all: Does someon...
# ieee-sscs-dc-22
h
Hi @jeffdi, @Micah Tseng all: Does someone know when we will receive the chips of the team Chip 3 - Austria, Brazil and USA1? (cc @Christof Gindu @Rohish Kumar Reddy mitta)
m
@jeffdi @Sara N For reference, looks like frame
B7
slot-013
on the
2211q
shuttle.
m
@Harald Pretl Yes. I've been direct messaging @Christof Gindu. They should arrive here on Monday the 20th. Unfortunately I am out of town until the 26th. I will split them out and ship them to you and @Leonardo Gomes as soon as I get back.
h
Thanks @Micah Tseng Do we need to design a PCB for the chips, or do they come mounted on an eval board?
m
I am not sure...
I just have the shipping notification
b
They should come on a board.
l
All of them? Only the QFNs? Or only the sample boards that come with the chipignite package?
b
@Leonardo Gomes I think you have a special arrangement, so I don't know. I am just saying that standard chipIgnite comes with boards.
m
I know we are getting 50 bare die and 50 QFN. How many QFN are on boards, I don't know.
The boards are news to me as of your message @Boris Murmann
b
@Ali Sabir can you share what your team has already received?
j
hello all, we received our samples! thanks once more to everyone who made this possible! we will be measuring this week, we'll keep you posted we didn't get any bare dies, though 😞 so all the measurements planned for pads in the user space are lost, unless we manage to decap some
a
Hi @Boris Murmann We received the Pakistan chip 1 and Chip 2 along with board. Right now, I just unbox the Pakistan chip 1 that is shown below.
m
I had a coworker open the package: 107 QFN loose, 10 QFN mounted to boards. No bare die.
l
@jeffdi
m
I know @Leonardo Gomes needs bare die to take any measurements so without bare die (unless we can decap some), this isn’t good
For our (USA1)’s purposes we at least need a micrograph photo of the die for publication, but we would strongly prefer bare die to access testing structures and take pictures ourselves.
l
Unless someone knows a way to decap epoxy WITHOUT destroying the dies, I'm all ears, otherwise I can't do anything with them. And I asked so many times for the bare dies - which is an option that is mentioned at the chipignite page. Have to say I'm very disappointed.
@Boris Murmann
@mkk @Nathan Pier @Sara N @Tim Edwards
@Mitch Bailey
😲 1
@Matt Venn
t
Not sure what happened there. If you requested bare dies, you should have received bare dies. I'm sure we have bare dies somewhere. We get loads of them from each wafer and we can't afford to have them all wirebonded.
j
It would be amazing if anyone could help us with that
t
In the worst case, there's a staff meeting tomorrow and somebody on that call should know who shipped out the parts and why there weren't any bare dies in those shipments.
👍 2
1
s
@Leonardo Gomes as I've contacted you via email regards your concern today, Jeff will get back to you soon.
l
@Tim Edwards yes, I'm baffled, as I have got many different pieces of information and different confirmations from different people. And in the end our request got lost somewhere... I'm already in contact with efabless to try to find a solution for this situation, however if you could follow that up on your side I would be much grateful
I saw your email @Sara N, and I'm chatting with Jeff in the slack chat. Thank you for your response. I just hope this situation gets solved, because otherwise me and my team would have lost our time...
j
We also requested bare die samples some time ago... https://open-source-silicon.slack.com/archives/C031R263TC7/p1695732930601429