Hi Shane, for first pass area estimates, I typically use an area of 100u x 200u for bond pads with associated digital I/0 circuitry, ESD structures, and Power Busses. For older silicon processes, Bond wires are typically put on a 100u spacing between each Bond wire. Hence the 100u width for the area estimate. I have not yet taped out anything in the Skywater 130 process, the above area estimate may be a bit pessimistic.