Is there someone I could speak to about the packaging of our chips? I have a concern about the custom pads (and the needed nitride opening) we put inside the caravel

@jeffdi or @Tim Edwards

@jeffdi @Tim Edwards can you confirm teams USA1, Austria and Brazil share of packaged chips/bare dies and that the nitride openings inside the user area were done, please?

If the designs had the "pad" layer over the openings, then they will have the cut on top. This has been done before without issue. You will get standard packaged parts which will presumably be unusable, and you will need to figure out what you want done with the bare dies (I don't know if you intend to use probes, or manually wirebond them yourselves, or find another packager).

We worked out a way to share the chips between us, and we asked before (I don't remember to whom now) if the Brazil team share could be left un-packaged as we will characterize them on chip (and wire-bond them later to bias the circuit, of course)

@Leonardo Gomes: You will need to make sure that @jeffdi and @Sara N know that you need bare dies rather than packaged parts so that we can ship you the bare dies.

It was to @Nathan Pier via e-mail

Probably it's fine to let Nathan know, but either Jeff or Sara have been the ones doing the shipping, to my knowledge, and anyway it will be best to issue a reminder just before it's time to ship parts.

I just messaged them, thank you for the information and for the help, as always!