open-source-silicon.dev

Please consider PROBLEM

<https://sites.tufts.edu/tcal/files/2022/06/ISCA22_HSSB_paper_0.pdf|Abstract: Implications of Power Density on Chip Design>

*“Local power density and temperature response must be incorporated as part of chip architecture and design. Aggregated power alone is no longer a sufficient metric.”*

<https://sites.tufts.edu/tcal/hssb-hotspots-strike-back/>

<https://sites.tufts.edu/tcal/files/2022/06/ISCA22_HSSB_paper_5.pdf|NNShim: Thermal Hotspots Simulation on ML Accelerators>

<https://sites.tufts.edu/tcal/files/2021/11/HotGauge_IISWC_2021.pdf|HotGauge: A Methodology for Characterizing Advanced Hotspots in Modern and Next Generation Processors>

<https://sites.tufts.edu/tcal/files/2022/06/ISCA22_HSSB_paper_4.pdf|Utilizing the HotGuage Framework for Hotspot Behavior Analysis David Werner*, Maziar Amiraski, Alexander Hankin, Julien Sebot, K>


Please consider SOLUTION

“Oscillator for adiabatic computation circuitry” Sandia Patent <https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20230114017>

Text <https://www.freepatentsonline.com/y2023/0114017.html>

“Oscillator for adiabatic computation circuitry”  — Strong link in USA Extreme-scale computing supply chain.

EUV “Crash or permanent damage imminent” HotSpots  – Weak link in USA Extreme-scale computing supply chain.

Please consider
<https://www.itu.int/rec/T-REC-L.1318/_page.print|L.1318 : Q factor: A fundamental metric expressing ...>

<https://www.itu.int/rec/T-REC-L.1318/_page.print|International Telecommunication Union>
<https://www.itu.int><https://www.itu.int/rec/T-REC-L.1318/_page.print| › rec › T-REC-L.1318 › _page>
Oct 25, 2022 — *L*.*1318* : Q factor: *A fundamental metric expressing integrated circuit energy efficiency* ; Recommendation *L*.*1318*. In force components.