If you are looking for the layout that includes the bump bond layers, that is a combined layout I made from the existing caravel chip and the bump bond layout. The bump bond layout is in a different technology than sky130. However, I added layer assignments in the sky130 tech file for magic so that it can read in the bump bond layout and display it. The bump bond layout itself can only be found in the
repository. There you can find magic and GDS views of it.