Hi All , two queries : 1 ) are the below timelines for chip ignite program are same for university ...

Ryan R

05/30/2022, 7:46 AM

Hi All , two queries : 1 ) are the below timelines for chip ignite program are same for university programs too ? 2206Q June 17, 2022 >>- October 12, 2022 2) ReRAM silicon can be provided in this timeline too , if tapeout is done on the 2206Q shuttle. 3) For previous MPWs , that had ReRAM inside , have the university / free shuttles received back the silicon ? Thanks

Boris Murmann

05/30/2022, 7:54 AM

@jeffdi

Tim Edwards

05/30/2022, 8:42 PM

MPW-four is the first batch to support ReRAM, and it is currently being bump bonded.

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