I've bought stencils for single QFN footprints before, anyone know of one for this specific wlcsp?

Buy one I would think

@User: It's a custom footprint. My understanding is that WSCLP chips are self-aligning and bond pretty easily with a hot air station. But that's second-hand information; I haven't tried it myself. I used to have difficulties with ball grid arrays, but those were huge and it was hard to heat them evenly. These chips are tiny by comparison, so that won't be an issue.

huh okay, good to know, and this would be without paste at all?

This is just off the top of my head, not from experience, but I would think that with the solder bumps being a well-controlled amount of solder, I would think that you can get away with not using any solder paste. At least, if you get back 100 bare die, you have some extras to experiment with. . .

I've done both and had good results both ways

I've had good success with just flux and no paste for similar sized parts. Just don't put too much flux, you don't want it "floating" on top of a pool of flux. You can also use a hotplate to solder , heating PCB from the bottom, tiny / lightweight parts are easy to send flying off.

nice

@User Can you share more details on the flux method? It would be nice to get the gerbers for the breakout board, too, if you happen to know where those are available. It is the simplest way to gen a mini stencil.