(and I thought waiting 10 days for 4 layers PCBs was bad 😅 )

This has slightly more than four layers. . .

Hehe yeah. Are the production steps for this process listed somewhere ? I'm not even sure how many masks / steps are involved here with all the various type of tweaking implants and capacitors support etc etc ....

I have a list of process steps but the document is marked "Company Confidential" so I don't think I can share it. But it has 28 steps from diffusion to passivation. But then the wafer gets shipped to Micross for the RDL, which has (I think) five additional steps.