Final 12 Hours to Master Thermal Analysis in Semiconductor Packaging Ever wondered why a Ball Grid Array (BGA) fails under stress? Take a look at this thermal simulation from our latest workshop: a 33°C hotspot (ambient: 20°C) reveals critical risks in chip packaging design. This is the kind of real-world challenge you’ll tackle in the NASSCOM, Ansys, IIT Gandhinagar, and VSD-led workshop closing registrations in 12 hours. Here’s what you’ll gain: • Thermal analysis expertise: Use Ansys tools to predict and mitigate hotspots. • Design optimization: Learn to reduce thermal gradients (like 33°C to 25°C) for reliable packaging. • Industry alignment: Apply methodologies used by top semiconductor firms. Why act now? 1. *Next cohort next month*—this is your only chance for next month. 2. Live simulations: Replicate this BGA case study in hands-on labs. 3. Career advantage: Thermal engineers command 30% higher salaries in semiconductors. Registration closes at midnight. Secure your spot here: https://www.vlsisystemdesign.com/packaging/