nasscom FutureSkills Prime, Ansys, Indian Institute of Technology Gandhinagar, and VLSI System Design (VSD) worked aggressively for last 6-months and are joining forces to tackle one of the biggest challenges in India’s tech ecosystem: building world-class talent in chip packaging. This isn’t just about simulations and engineering - it’s about creating a future where India leads in designing, testing, and packaging the cutting-edge chips that power everything from smartphones to AI. https://vsdsquadron.vlsisystemdesign.com/packaging/ For students and young engineers, this is your moment. Imagine learning from global experts at Ansys, collaborating with IIT Gandhinagar’s brightest minds, and applying VSD’s industry-driven methodologies. Now, picture yourself walking through a state-of-the-art packaging facility, seeing theory turn into practice. That future is closer than you think (this will be announced very soon). This initiative isn’t just about skills - it’s about ownership. Ownership of India’s semiconductor ambitions. Ownership of innovation that drives self-reliance. Ownership of a career that matters. The registration window is closing soon, but the opportunity to be part of this movement is wide open. Whether you’re a student hungry to learn or a professional ready to upskill, step forward. Let’s build a India where talent isn’t a gap - it’s our greatest strength. 👉 Register now (https://vsdsquadron.vlsisystemdesign.com/packaging/) before the deadline in 5 days. Let’s rewrite the story of Indian tech - together. Thank you so much Tarun Agarwal, Aroop Tyagi and Abhimanyu Singh. This wouldn't have been possible without your continous follow-ups and passion towards the subject and towards the Nation