<#245 Pad.kR rule vs openroad PAD> Issue created b...
# ihp-sg13g2
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#245 Pad.kR rule vs openroad PAD Issue created by britovski Environment klayout 0.29.7 Expected Behavior DRC clean? Actual Behavior 144 Pad.kR rule violations Steps to Reproduce the Problem 1. Just open bondpad_70x70.gds from https://github.com/The-OpenROAD-Project/OpenROAD-flow-scripts/tree/master/flow/platforms/ihp-sg13g2/gds 2. Run DRC maximal I saw that is an expressed rule on SG13G2_os_layout_rules manual that says: "TopVia2 under Pad not allowed (Note 3)" Note 3. TopVia2 may be damaged during packaging process, we recommend not to use them below Passiv. The openroad PAD has stacked all metal layers to easy the connections from the chip but how can deal with the note 3 about the violation? IHP-GmbH/IHP-Open-PDK