@Matt Venn@Uri Shaked This is a repost of @David Lindley’s question on the efabless slack.
How does TT run fill? TT08 is the only die on 2409 to have m3 and m4 minimum fill area violations. We saw these way back on 2404 and made an update to the magic tech file to fix. This should be what is used in the platform tapeout process. I could think it was an openframe issue, but there are other openframe chips on the tapeout and they did not have this issue?
Is it possible that TT08 on 2409 is using an older version of the pdk for
chip_io_openframe
and fill generation? The current tapeout pdk version is
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