Anyone knows the die thickness after thinning for QFN packaging for CI2211Q-R run? @Tim Edwards @jeffdi

The bare dies for MPW-7 are marked on the package as being 254um thick. I assume that all dies were background at the same time, so that the bare dies have the same thickness as the packaged parts. Jeff should be able to confirm that. We are using the same packager for chipIgnite and I don't think we've changed any specs.

ok, thank you Tim!! @jeffdi can you confirm the above pls?