@Leonardo Gomes so in SG13G2 yo can expose bond pads on TopMetal2,. During the technology process top metal 2 is fully covered with passivation and then the respective openings are made in order to access bond pads, which can be used for wire bonding or Cu pillars for die-to-die connections.

Thank you, @Krzysztof Herman for the clarification. Would it also work for measurement pads? Like GSG pads for RF probes, for example.

@Leonardo Gomes I do not have this knowledge, let me ask some experts here at IHP. I suppose that until you respect the DRC rules you are allowed to layout whatever pad structures you want, but it is only my supposition.

Thank you again for the information. Looking forward to having the answer.

@Leonardo Gomes the answer is affirmative. In the PDK, we have a pcell named "bondpad" it has necessary no DRC region, so that you can make RF pads

I see, thank you so much for the clarification!