In lower nodes, several emerging areas are gaining...
# general
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In lower nodes, several emerging areas are gaining importance due to the increased complexity and challenges associated with these advanced technologies. Here are some of the key emerging areas: Don't miss the STA bootcamp - contact and book your seat - https://api.whatsapp.com/send/?phone=919817182494&text=Hi+vlsideepdive%2C+I+have+a+query&type=phone_number&app_absent=0 Variability Analysis: As the nodes shrink, the impact of process variations on the timing becomes more significant. Advanced STA tools now include variability analysis to account for these variations. This includes analyzing the impact of manufacturing variations, environmental conditions, and voltage fluctuations. Aging Analysis: Smaller node sizes make circuits more susceptible to aging effects like Bias Temperature Instability (BTI), Hot Carrier Injection (HCI), and Electromigration (EM). STA tools are increasingly incorporating aging analysis to predict how the timing of circuits will degrade over time. Advanced On-Chip Variation (AOCV) and POCV Modeling: Traditional STA methods use a single set of delay numbers for each cell. However, in lower nodes, on-chip variation becomes more pronounced, and Advanced On-Chip Variation (AOCV) or Path-Dependent On-Chip Variation (POCV) models are used. These models provide a more accurate representation of variations in the delays of individual transistors and interconnects. Statistical Static Timing Analysis (SSTA): Unlike traditional STA, which uses deterministic methods, SSTA uses statistical methods to analyze timing. This approach is more suitable for lower nodes where variability is high, as it provides a more accurate representation of the likelihood of timing failures. Integration with Power Analysis: Lower nodes are not only susceptible to timing issues but also to power integrity problems. The integration of STA with power analysis tools is crucial for a comprehensive understanding of the performance under various power conditions. 3D-IC Timing Analysis: With the advent of 3D-ICs, STA needs to address the challenges posed by the vertical stacking of devices. This includes the analysis of thermal effects, inter-layer interconnect delays, and the impact of through-silicon vias (TSVs). Signal Integrity and Electromagnetic Analysis: At lower nodes, signal integrity issues like crosstalk become more pronounced, and electromagnetic interference can also impact the timing. STA tools are evolving to include these analyses to ensure accurate timing verification. Happy Learning!