i would like to know how wirebond-pads and ESD-protection should be done in iHPs and skywaters 130nm BiCMOS processes. is there some documentation? i didnt found anything in the PDKs

A crude but very effective approach would be to copy the PAD structure used on SKY130. As noted elsewhere I think ~10E+12 of these pads have shipped. For the ESD structure depends a lot on what you're trying to protect and how much protection it needs. Skywater usually has documents under NDA for any of their proprietary technologies. In Open Source SKY130 has plenty of public documentation of its IOs and they already contain ESD protection designed to a high standard.

thanks for Your answer. i want to protect CMOS-instrumentation-amplifier-inputs, whit low lekage, some analog pins for setting currents via external resistors and and current source output that goes to 6GHz. the sykwater-io i saw are more for low frequency and have complex functionality that i dont need. i could try to use some parts of it. but i didnt found there internal schematics.