Does anyone know whether efabless can provide shuttle runs with DIP packages? It would be really cool to use the sky130 5V capability to clone some old chips that are long out of production.

In theory yes, but they probably wont... But maybe you could ask efabless if they could not package it and then you could send it to a packaging provider or university with a bonder yourself. I think thats more likely than packaging in a DIP. I think Kyocera actually offers ceramic DIP Packages. Otherwise I really recommend the Video from Sam Zeloof about his wirebonder...

thx, that could work

Would require some coordination but un packaged devices are as Enno suggested a much easier option than legacy packaging.